The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Apr. 14, 2014
Applicant:

Ascent Solar Technologies, Inc., Thornton, CO (US);

Inventors:

Mohan S. Misra, Golden, CO (US);

Prem Nath, Fort Lauderdale, FL (US);

Venugopala R. Basava, Highlands Ranch, CO (US);

Assignee:

Ascent Solar Technologies, Inc., Thornton, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/042 (2014.01); H01L 31/18 (2006.01); H01L 31/05 (2014.01); H01L 31/0465 (2014.01);
U.S. Cl.
CPC ...
H01L 31/1876 (2013.01); H01L 31/0465 (2014.12); H01L 31/05 (2013.01); Y02E 10/50 (2013.01);
Abstract

A process of forming an array of monolithic ally integrated thin film photo voltaic cells from a stack of thin film layers formed on an insulating substrate includes forming at least one cell isolation scribe in the stack of thin film layers. A second electrical contact layer isolation scribe is formed for each cell isolation scribe adjacent to a respective cell isolation scribe. A via scribe is formed in the stack of thin film layers between each cell isolation scribe and its respective second electrical contact layer isolation scribe. Insulating ink is disposed in each cell isolation scribe, and conductive ink is disposed in each via scribe to form a via. Conductive ink is also disposed along the top surface of the stack of thin film layers to form at least one conductive grid.


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