The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

May. 22, 2017
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Takayasu Kanesada, Yamato, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 27/146 (2006.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 31/18 (2013.01); H01L 27/1462 (2013.01); H01L 27/1463 (2013.01); H01L 27/14621 (2013.01); H01L 27/14623 (2013.01); H01L 27/14625 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H01L 27/14645 (2013.01); H01L 27/14685 (2013.01); H01L 31/0232 (2013.01); H01L 27/14609 (2013.01); H01L 27/14612 (2013.01); H01L 27/14643 (2013.01);
Abstract

A method of manufacturing a solid-state image sensor is provided. A first insulating member and an electrically conductive member is formed above a semiconductor substrate. A connecting portion of an upper surface of the electrically conductive member is covered with part of the first insulating member. First openings corresponding to the photoelectric conversion units are formed in the first insulating member. A second insulating member covering the first insulating member is then formed. The second insulating member is partially removed to expose the part of the first insulating member covering the connecting portion. A third insulating member that covers the first and second insulating members is then formed. The third insulating member is partially removed to expose the second insulating member. A second opening to expose the connecting portion is then formed to form a plug.


Find Patent Forward Citations

Kanesada, Takayasu. (2018). Method of manufacturing solid-state image sensor (U.S. Patent No. 9929303). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9929303

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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