logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9929201 B1

PDFFull Text
Date of Patent:
Mar. 27, 2018

Filed:

Aug. 19, 2016

Image pickup apparatus and image pickup apparatus manufacturing method

Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Jumpei Yoneyama, Nagano, JP;

Takahiro Shimohata, Nagano, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:

Scully, Scott, Murphy & Presser, P.C.

Primary Examiner:

Cuong Q Nguyen

Assistant Examiner:

Tong-Ho Kim

Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 31/02 (2006.01); H04N 5/335 (2011.01); H05K 1/11 (2006.01); H04N 5/225 (2006.01); H05K 1/02 (2006.01); H01L 31/0203 (2014.01);
U.S. Cl.
CPC ...
H01L 27/14632 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 27/14687 (2013.01); H01L 31/02005 (2013.01); H04N 5/2253 (2013.01); H04N 5/335 (2013.01); H05K 1/118 (2013.01); H01L 31/0203 (2013.01); H01L 2924/0002 (2013.01); H05K 1/028 (2013.01); H05K 2201/0373 (2013.01); H05K 2201/0382 (2013.01); H05K 2201/0397 (2013.01); H05K 2201/09154 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/09845 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/049 (2013.01);
Abstract

An image pickup apparatus is configured with an image pickup device on which a plurality of bumps are arranged in line on an outer circumferential portion of a light receiving surface; and a flexible wiring board including a plurality of inner leads each of which is configured with a distal end portion, a bending portion and a rear end portion, the distal end portion being compression-bonded to a bump, and the rear end portion being arranged parallel to a side face of the image pickup device with the bending portion interposed between the distal end portion and the rear end portion. A height of a light receiving portion side of the bumps is lower than a height of a side face side; and each of the inner leads is plastically transformed according to a shape of a top face of the bumps.

Find Patent Forward Citations

Loading…