The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Nov. 07, 2012
Applicant:

Japan Science and Technology Agency, Saitama, JP;

Inventors:

Tatsuya Shimoda, Ishikawa, JP;

Toshihiko Kaneda, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); H01L 27/12 (2006.01); H01L 45/00 (2006.01); H01L 41/09 (2006.01); H01L 41/317 (2013.01); H01L 41/332 (2013.01); H01L 29/786 (2006.01); B41J 2/16 (2006.01); H01L 21/67 (2006.01); H01L 27/108 (2006.01); H01L 21/28 (2006.01); H01L 29/78 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1255 (2013.01); B41J 2/161 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1637 (2013.01); B41J 2/1645 (2013.01); H01L 21/67098 (2013.01); H01L 27/10805 (2013.01); H01L 27/10873 (2013.01); H01L 27/127 (2013.01); H01L 27/1262 (2013.01); H01L 29/7869 (2013.01); H01L 41/0973 (2013.01); H01L 41/317 (2013.01); H01L 41/332 (2013.01); H01L 45/1206 (2013.01); H01L 45/1226 (2013.01); H01L 45/147 (2013.01); H01L 45/1608 (2013.01); H01L 21/28291 (2013.01); H01L 28/55 (2013.01); H01L 29/78391 (2014.09);
Abstract

According to the present invention, a method of producing a functional device includes the imprinting step and the functional solid material layer formation step. In the imprinting step, a functional solid material precursor layer obtained from a functional solid material precursor solution as a start material is imprinted so that a first temperature of a heat source for supplying heat to the functional solid material precursor layer is higher than a second temperature of the functional solid material precursor layer in at least part of a time period while a mold for forming an imprinted structure is pressed against the functional solid material precursor layer. In the functional solid material layer formation step, after the imprinting step, the functional solid material precursor layer is heat treated at a third temperature higher than the first temperature in an atmosphere containing oxygen to form a functional solid material layer from the functional solid material precursor layer.


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