The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Aug. 19, 2016
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventor:

Kenji Aoyama, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 27/11568 (2017.01); H01L 27/11521 (2017.01); H01L 27/11556 (2017.01); G11C 16/26 (2006.01); G11C 16/08 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 27/11521 (2013.01); H01L 27/11556 (2013.01); H01L 27/11568 (2013.01); G11C 16/08 (2013.01); G11C 16/26 (2013.01);
Abstract

A semiconductor memory device according to an embodiment comprises: a semiconductor substrate; a semiconductor layer provided extending in a first direction above the semiconductor substrate, on the semiconductor substrate; a first insulating layer provided on a side surface of the semiconductor layer; a charge accumulation layer provided on a side surface of the first insulating layer; a block insulating layer provided on a side surface of the charge accumulation layer; and a plurality of conductive layers stacked in the first direction via an insulating layer, in a periphery of the block insulating layer. The block insulating layer includes: a first block insulating layer; and a second block insulating layer that has a permittivity which is higher than that of the first block insulating layer. A lower end of the second block insulating layer is positioned more upwardly than a lower end of the first insulating layer.


Find Patent Forward Citations

Loading…