The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Jun. 08, 2015
Applicant:

Analog Devices, Inc., Norwood, MA (US);

Inventors:

Cemin Zhang, Nashua, NH (US);

John A. Chiesa, Pelham, NH (US);

Assignee:

Analog Devices, Inc., Norwood, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/08 (2006.01); H03B 5/18 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H03B 5/12 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 23/66 (2013.01); H01L 24/06 (2013.01); H01L 24/15 (2013.01); H03B 5/1225 (2013.01); H03B 5/1243 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6661 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92163 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1423 (2013.01); H03B 2200/0008 (2013.01); H03B 2200/0076 (2013.01);
Abstract

Aspects of this disclosure relate to a first die includes an LC resonant circuit including a first capacitive element, such as a capacitor or a varactor, and an inductive element. The LC resonant circuit is configured to generate a signal having a frequency of oscillation. The first die includes bump pads electrically coupled to both ends of the first capacitive element. A second die can be flip chip mounted on the first die. Bumps can electrically connect a second capacitive element of the second die in parallel with the first capacitive element of the first die. This can increase the Q factor of the LC resonant circuit.


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