The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Jun. 05, 2014
Applicant:

John Cleaon Moore, Camirillo, CA (US);

Inventor:

John Cleaon Moore, Camirillo, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01); B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); H01L 21/67132 (2013.01); H01L 21/67313 (2013.01); H01L 21/67346 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); Y10T 156/1111 (2015.01); Y10T 156/1116 (2015.01);
Abstract

The invention describes the ability to conduct multiple carrier substrate removal practices simultaneously. The fixture design is slotted in a manner to hold film frame rings and has the bottom region open without interference to the passage of the released carrier substrate. Slots in the fixture are arranged on two sides at top and bottom to support the film frame, however, the distance between the slots and the area of the open region is sufficient to allow the carrier substrate to travel downwards under gravity force, once it has been released from the device wafer. The method describes a batch process whereby a fixture design supports multiple film frames with taped adhered device wafers enable exposure to a chemical medium that either acts upon the interface between the device wafer and carrier substrate or digests the carrier substrate in a manner that results in removal.


Find Patent Forward Citations

Loading…