The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Feb. 19, 2013
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Jeremy C. Franklin, San Francisco, CA (US);

Kevin D. Gibbs, San Carlos, CA (US);

Amy Qian, San Jose, CA (US);

John Raff, Menlo Park, CA (US);

Carl R. Peterson, Santa Clara, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G09F 13/04 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G09F 13/0413 (2013.01); H05K 1/028 (2013.01); H05K 1/0274 (2013.01); H05K 1/147 (2013.01); H05K 1/189 (2013.01); H05K 2201/10128 (2013.01);
Abstract

Electronic devices may include displays. A display may include backlight structures that generate light and display layers that generate images using the generated light. An electronic device may include an opaque flexible printed circuit that is wrapped around one or more edges of the backlight structures. The opaque flexible printed circuit may prevent light from the backlight structures from reaching other electronic components or escaping from the device. The opaque flexible printed circuit may include signal lines that communicate signals between a printed circuit board and the display. The opaque flexible printed circuit may be a layer of the printed circuit board that extends from an edge of the printed circuit board. The printed circuit board may include an additional flexible extended printed circuit layer that wraps around a surface of the printed circuit board and forms a portion of a conductive shield over that surface.


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