System and method for processing substrates

Abstract

The present invention relates to a system for processing coated substrates, having the following features: at least one evacuable process box for accommodating at least one substrate with a gas-tightly sealable housing, which forms a hollow space, wherein the housing comprises at least one housing section, which is implemented such that the substrate is thermally treatable by incident electromagnetic thermal radiation, wherein the housing has at least one housing section coupleable to a cooling device for its cooling and at least one housing section not coupled to the cooling device, wherein the hollow space is divided by at least one separating wall into a process space for accommodating the substrate and an intermediate space, wherein the separating wall has one or a plurality of openings and is arranged between the substrate and the housing section coupled to the cooling device, and wherein the housing is provided with at least one sealable gas passage that opens into the hollow space, for evacuating and introducing gas into the hollow space; a cooling device for cooling the process box housing section coupleable to the cooling device; at least one loading/unloading unit for loading and/or unloading the process box; at least one heating unit for heating the substrate in the process box; at least one cooling unit for cooling the substrate in the process box; at least one pumping-out device for draining the hollow space of the process box; at least one gas supply device for supplying the hollow space of the process box with at least one gas; at least one transport mechanism, which is implemented for the purpose of executing a relative movement between, on the one hand, the process box and, on the other, the heating, cooling, and loading/unloading unit.