The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
Nov. 12, 2015
Applicant:
Uchicago Argonne, Llc, Chicago, IL (US);
Inventors:
Osman L. Erylimaz, Plainfield, IL (US);
Harpal Singh, Cuyahoga Falls, OH (US);
Aaron C. Greco, Chicago, IL (US);
Jair G. Ramirez Gonzalez, Naperville, IL (US);
Ali Erdemir, Naperville, IL (US);
Assignee:
UChicago Argonne, LLC, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/27 (2006.01); C23C 14/35 (2006.01); C23C 14/06 (2006.01); C23C 14/34 (2006.01); C23C 14/02 (2006.01); C01B 32/25 (2017.01);
U.S. Cl.
CPC ...
C23C 14/0611 (2013.01); C01B 32/25 (2017.08); C23C 14/021 (2013.01); C23C 14/024 (2013.01); C23C 14/0605 (2013.01); C23C 14/0635 (2013.01); C23C 14/3485 (2013.01); C23C 14/35 (2013.01);
Abstract
A method for making a pitting resistant carbon coating that includes a hydrogenated diamond-like coating ('H-DLC'). The H-DLC is relatively soft and elastic. Unlike hard and/or inelastic coatings in the prior art, the present coatings do not exhibit a loss of adhesion (delamination). A bonding layer may be deposited on a metallic substrate and the deposited H-DLC on the bonding layer.