The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Oct. 21, 2013
Applicant:

Avery Dennison Corporation, Glendale, CA (US);

Inventor:

Neal Carty, Mentor, OH (US);

Assignee:

Avery Dennison Corporation, Glendale, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09J 183/04 (2006.01); C09J 7/02 (2006.01); A61L 15/58 (2006.01); B32B 43/00 (2006.01); C09J 5/00 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C09J 133/00 (2006.01);
U.S. Cl.
CPC ...
C09J 7/0246 (2013.01); A61L 15/585 (2013.01); B32B 43/006 (2013.01); C09J 5/00 (2013.01); C09J 7/0285 (2013.01); C09J 183/04 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C09J 133/00 (2013.01); C09J 2201/606 (2013.01); C09J 2205/102 (2013.01); C09J 2205/11 (2013.01); C09J 2205/302 (2013.01); C09J 2433/00 (2013.01); C09J 2467/005 (2013.01); C09J 2483/00 (2013.01); Y10T 156/1111 (2015.01); Y10T 428/1457 (2015.01); Y10T 428/259 (2015.01); Y10T 428/2891 (2015.01);
Abstract

A two-phase adhesive composition and selective debonding agent are described. The adhesive composition comprises a substantially continuous first phase comprising a pressure sensitive adhesive and a discontinuous second phase comprising crosslinked silicone gel microparticles. When applied, the selective debonding agent is absorbed by the gel microparticles. The gel microparticles change size or shape and facilitate debonding the adhesive from a substrate by decreasing the contact area between the adhesive and the substrate. Methods to selectively debond pressure sensitive adhesive compositions, methods of making the pressure sensitive adhesive compositions, articles that utilize the pressure sensitive adhesive composition, adhesive systems, and kits that include an article containing the pressure sensitive adhesive composition and the selective debonding agent, are also described.


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