The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Feb. 05, 2015
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Johannes Classen, Reutlingen, DE;

Torsten Kramer, Wannweil, DE;

Hubert Benzel, Pliezhausen, DE;

Jens Frey, Filderstadt, DE;

Daniel Christoph Meisel, Pittsburgh, PA (US);

Christoph Schelling, Stuttgart, DE;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); B81B 7/00 (2006.01); B81C 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81C 3/001 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81C 2201/019 (2013.01); B81C 2201/0132 (2013.01);
Abstract

A sensor unit including a first semiconductor component and a second semiconductor component, the first semiconductor component including a first substrate and a sensor structure. The second semiconductor component includes a second substrate, the first and second semiconductor components being connected to each other with the aid of a wafer connection, the sensor unit having a decoupling structure, which is configured in such a way that the sensor structure is decoupled thermally and/or mechanically from the second semiconductor component.


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