The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Mar. 12, 2014
Applicant:

Robotica, Inc., Spring, TX (US);

Inventor:

Jay Mark Dugat, Spring, TX (US);

Assignee:

Robotica, Inc., Spring, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65B 69/00 (2006.01); B65B 57/02 (2006.01); B65B 59/02 (2006.01); B23K 26/03 (2006.01); B23K 26/08 (2014.01); B23K 26/12 (2014.01); B23K 26/38 (2014.01); B23K 26/40 (2014.01); B23K 26/082 (2014.01); B23K 26/402 (2014.01); B26D 3/12 (2006.01); B26D 5/08 (2006.01); B26D 7/06 (2006.01); B23K 101/04 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B65B 69/0033 (2013.01); B23K 26/03 (2013.01); B23K 26/082 (2015.10); B23K 26/0838 (2013.01); B23K 26/127 (2013.01); B23K 26/38 (2013.01); B23K 26/402 (2013.01); B26D 3/12 (2013.01); B26D 5/08 (2013.01); B26D 7/0625 (2013.01); B65B 57/02 (2013.01); B65B 59/02 (2013.01); B23K 2201/04 (2013.01); B23K 2203/40 (2015.10);
Abstract

The following simplified summary is provided in order to provide a basic understanding of some aspects of the claimed subject matter. Its purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later. In certain embodiments a system for opening packages is provided comprising a conveyer for supporting or conveying a package, wherein the package comprises a surface material and a measurement zone wherein the package is inspected and measured for a cutting operation to thereby determine a process location comprising a location on the package for introduction of a cut to the surface material.


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