The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Jul. 29, 2013
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Yuji Tanaka, Osaka, JP;

Kenji Okumoto, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); G02F 1/1333 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
B32B 38/10 (2013.01); G02F 1/133305 (2013.01); G02F 2202/28 (2013.01); H01L 21/6835 (2013.01);
Abstract

A manufacturing method of a flexible device comprises: an adjustment step of adjusting adhesive characteristics of an adhesive layer formed over a supporting substrate; a temporary bonding step of temporarily bonding the flexible substrate; an electronic device formation step of forming an electronic device; and a separation step of separating the flexible substrate. In the adjustment step, the adhesive characteristics of the adhesive layer are adjusted to satisfy a relationship of P<P, where Pdenotes a peel strength of the adhesive layer after the electronic device formation step, in a case where the adhesive layer undergoes the electronic device formation step without undergoing the adjustment step, and Pdenotes a peel strength of the adhesive layer after the electronic device formation step, in a case where the adhesive layer undergoes the electronic device formation step after undergoing the adjustment step.


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