The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Jul. 07, 2016
Applicant:

Rolling Optics Ab, Solna, SE;

Inventor:

Axel Lundvall, Bjursås, SE;

Assignee:

Rolling Optics AB, Solna, SE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); B29D 11/00 (2006.01); B41F 9/00 (2006.01); B41M 1/00 (2006.01); G02B 3/00 (2006.01); G03F 7/00 (2006.01); B29C 65/00 (2006.01); B41M 1/10 (2006.01); B41F 11/00 (2006.01);
U.S. Cl.
CPC ...
B32B 37/025 (2013.01); B29D 11/00288 (2013.01); B41F 9/00 (2013.01); B41F 11/00 (2013.01); B41M 1/10 (2013.01); G02B 3/0031 (2013.01); G03F 7/0002 (2013.01); B32B 2305/72 (2013.01); Y10T 156/17 (2015.01);
Abstract

A method for manufacturing a printed product comprises provision of a matrix comprising a matrix surface having at least one recess. A first curable compound is applied to the matrix surface in a controlled amount that does not exceed a volume of the recess(es). The first curable compound creep down in and partly fill the recess(es), leaving protruding surfaces substantially free from the first curable compound. The matrix surface and recess(es) are covered by a pickup layer of a second curable compound. The matrix is brought in contact with the substrate surface and the first curable compound and the second curable compound are cured. The matrix surface is separated from the substrate surface, leaving the pickup layer and the first curable compound on the substrate surface. The first curable compound forms printed product micro features at the pickup layer covering the substrate surface.


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