The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
Aug. 13, 2014
Applicant:
Olympus Corporation, Tokyo, JP;
Inventor:
Yoshitaka Otsuka, Hino, JP;
Assignee:
Olympus Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/36 (2006.01); B29C 45/40 (2006.01); B29C 45/56 (2006.01); B29L 11/00 (2006.01); B29C 45/64 (2006.01);
U.S. Cl.
CPC ...
B29C 45/36 (2013.01); B29C 45/401 (2013.01); B29C 45/561 (2013.01); B29C 45/40 (2013.01); B29C 45/64 (2013.01); B29C 2045/4063 (2013.01); B29L 2011/0016 (2013.01);
Abstract
Fixed side molding dies are removed from fixed side molding dies insertion hole portions in accordance with the disconnection in the connection/disconnection while maintaining a contact state that a second transfer portion is in contact with a portion other than a fixed side optical functional surface of each molded article at the time of mold opening of a fixed die and a movable die. Thereby a first transfer portion is released from the fixed side optical functional surface.
Otsuka, Yoshitaka. (2018). Molding die structure of molded article and manufacturing method of molded article (U.S. Patent No. 9925705). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9925705
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile