The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Sep. 19, 2013
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka-shi, Osaka, JP;

Inventors:

Takashi Nakagawa, Osaka, JP;

Mitsuhiro Yoshinaga, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29B 11/00 (2006.01); B29C 45/72 (2006.01); B29K 101/00 (2006.01); B29K 703/00 (2006.01); B29L 9/00 (2006.01); B29L 31/30 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14827 (2013.01); B29B 11/00 (2013.01); B29C 45/14262 (2013.01); B29C 45/7207 (2013.01); B29C 45/14811 (2013.01); B29K 2101/00 (2013.01); B29K 2703/00 (2013.01); B29K 2715/006 (2013.01); B29K 2995/002 (2013.01); B29K 2995/0087 (2013.01); B29L 2009/00 (2013.01); B29L 2031/30 (2013.01); B29L 2031/762 (2013.01);
Abstract

An in-mold molding method of the present invention is a method including: placing an in-mold transfer film in the cavity of an injection molding mold, the in-mold transfer film having a hard coating layer and a transfer section of a printed layer; and peeling, from the base material film of the in-mold transfer film, the transfer section transferred to a molding resin when a molding molded by injecting the molding resin into the cavity is removed by mold opening. The hard coating layer is ruptured in a mold opening process while the in-mold transfer film has a necessary elongation of A % on the side of the molding and the hard coating layer has a rupture elongation of at least A %+2% and less than A %+40% on the side of the molding. With this configuration, the in-mold transfer film can be stably peeled during in-mold molding.


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