The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
Dec. 27, 2013
Hitachi Chemical Company, Ltd., Tokyo, JP;
Masaya Ozawa, Tokyo, JP;
Masao Sugiyama, Tokyo, JP;
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Abstract
Provided herein is an apparatus of manufacturing a molding material for use in a method of manufacturing a molding material that can prevent a crack from occurring in the molding material. A cylindrical die () is slid downward along an upper hollow compression mold () and a lower hollow compression mold () with a molding material () held between the upper hollow compression mold () and the lower hollow compression mold (). After that, the upper hollow compression mold () is moved upward to relatively move the upper hollow compression mold () and the lower hollow compression mold () away from each other. After a slurry diffusion member () is removed, the molding material () is taken out.