The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 2018

Filed:

Sep. 18, 2015
Applicant:

Origin Electric Company, Limited, Saitama, JP;

Inventor:

Hiroji Sasaki, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 11/00 (2006.01); B23K 33/00 (2006.01); B23K 11/16 (2006.01); B23K 11/02 (2006.01); C21D 1/40 (2006.01); C21D 9/50 (2006.01); B23K 103/04 (2006.01); B23K 103/06 (2006.01);
U.S. Cl.
CPC ...
B23K 11/002 (2013.01); B23K 11/02 (2013.01); B23K 11/16 (2013.01); B23K 33/00 (2013.01); C21D 1/40 (2013.01); C21D 9/50 (2013.01); B23K 2203/04 (2013.01); B23K 2203/06 (2013.01);
Abstract

To bond bonding target members stacked on top of each other without generating dust or spatter into an electrically bonded article with improved mechanical strength against strong vibration etc. A first bonding target member or second bonding target member includes a relative displacement amount setting portion for setting the distance by which the bonding target portion of the first member and the bonding target portion of the second member are relatively displaced during bonding, and a current conduction suppressing layer is formed on the relative displacement amount setting portion. The second or first member includes a setting face that is placed opposed to the current conduction suppressing layer of the first or second member. In a state where the first and second members have been positioned, the distance between the current conduction suppressing layer and the setting face is equal to the width H of the bonded portion.


Find Patent Forward Citations

Loading…