The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
Sep. 10, 2014
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Yasuo Fukuhara, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); B23K 3/06 (2006.01); H01L 21/48 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0669 (2013.01); H01L 21/4853 (2013.01); H01L 23/49816 (2013.01); H05K 3/3436 (2013.01); H05K 3/3463 (2013.01); H01L 23/49827 (2013.01); H01L 2224/1183 (2013.01); H01L 2224/11822 (2013.01); H01L 2224/131 (2013.01); H01L 2224/133 (2013.01); H01L 2224/138 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13076 (2013.01); H01L 2224/1379 (2013.01); H01L 2224/13562 (2013.01); H01L 2224/13564 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/3201 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81193 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/041 (2013.01); H05K 2203/047 (2013.01); H05K 2203/0465 (2013.01); Y02P 70/613 (2015.11);
Abstract
A semiconductor component includes a semiconductor package having a mountable face, a bump, and a coating part. The bump is made of first solder and is formed on the mountable face. The coating part formed of a first composition containing solder powder made of second solder, a flux component, and a first thermosetting resin binder coats the top end of the bump.