The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Dec. 03, 2013
Applicant:
Lpkf Laser & Electronics Ag, Garbsen, DE;
Inventors:
Roman Ostholt, Isernhagen, DE;
Robin Alexander Krueger, Hannover, DE;
Bernd Roesener, Porta Westfalica, DE;
Eugen Haumann, Seelze, DE;
Assignee:
LPKF LASER & ELECTRONICS AG, Garbsen, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/16 (2006.01); C23C 18/20 (2006.01); C23C 18/18 (2006.01); C23C 18/30 (2006.01); H05K 3/18 (2006.01); C25D 5/00 (2006.01); C25D 5/02 (2006.01); H05K 3/00 (2006.01); H05K 3/38 (2006.01); B44F 3/00 (2006.01); C23C 18/31 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/181 (2013.01); B44F 3/00 (2013.01); C23C 18/165 (2013.01); C23C 18/1608 (2013.01); C23C 18/204 (2013.01); C23C 18/2013 (2013.01); C23C 18/31 (2013.01); C25D 5/00 (2013.01); C25D 5/02 (2013.01); H05K 1/0296 (2013.01); H05K 3/0014 (2013.01); H05K 3/182 (2013.01); H05K 3/381 (2013.01); C23C 18/1841 (2013.01); C23C 18/208 (2013.01); C23C 18/30 (2013.01); H05K 2201/2072 (2013.01); H05K 2203/0113 (2013.01);
Abstract
A method for the at least portion-wise and adhesive metallization of a non-conductive workpiece includes introducing periodic microstructures into the workpiece in regions to be metallized, within an area to be metallized that is enclosed by one or more limiting lines, by molding a tool that is microstructured in accordance with the regions to be metallized within a molding area.