The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Aug. 15, 2017
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Masaaki Asano, Tokyo, JP;

Hiroshi Mawatari, Tokyo, JP;

Takafumi Okamura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/66 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01L 21/486 (2013.01); H01L 22/32 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49883 (2013.01); H01L 25/0657 (2013.01); H05K 3/4038 (2013.01); H01L 2225/06548 (2013.01);
Abstract

The structural body related to the present disclosure includes a substrate having insulation properties arranged with a first surface and a second surface opposing the first surface, a through hole passing through the first surface and the second surface of the substrate, and a through electrode including a conductive material arranged within the through hole, the through electrode conducting the first surface and the second surface of the substrate and including a projection part exposed from the second surface to the outside of the through hole, wherein at least a part of the through hole is gradually increasing in size approaching the second surface in a thickness direction of the substrate, and forming a depression part keeping a gap between the through hole and the through electrode.


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