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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9924594 B1

PDFFull Text
Date of Patent:
Mar. 20, 2018

Filed:

Sep. 29, 2014

Power semiconductor module and method for producing a power semiconductor module

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Andre Arens, Ruethen, DE;

Juergen Hoegerl, Regensburg, DE;

Magdalena Hoier, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Yuriy Semenenko

Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/11 (2006.01); H01L 21/56 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); H05K 7/14 (2006.01); H05K 1/14 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 21/56 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H05K 1/0256 (2013.01); H05K 1/181 (2013.01); H05K 3/28 (2013.01); H05K 7/1432 (2013.01); H01L 23/3121 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01); H05K 1/144 (2013.01); H05K 3/284 (2013.01); H05K 2201/0104 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/10318 (2013.01);
Abstract

A printed circuit board (PCB) has a first, structured metalization arranged on its top side and at least one second metalization arranged below the first metalization in a vertical direction, parallel to the first metalization and insulated therefrom. Also on the PCB top side is a bare semiconductor chip having contact electrodes connected by bonding wires to corresponding contact pads of the first metalization on the PCB top side. A first portion of the contact electrodes and corresponding contact pads carry high voltage during operation. All high-voltage-carrying contact pads are conductively connected to the second metalization via plated-through holes. An insulation layer completely covers the chip and a delimited region of the PCB around the chip, and all high-voltage-carrying contact pads and the plated-through holes are completely covered by the insulation layer. A second portion of the contact electrodes and corresponding contact pads are under low voltages during operation.

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