The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

May. 19, 2016
Applicants:

Tomoyoshi Kobayashi, Aichi, JP;

Masato Kasashima, Gifu, JP;

Inventors:

Tomoyoshi Kobayashi, Aichi, JP;

Masato Kasashima, Gifu, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H05K 1/0271 (2013.01); H05K 3/0061 (2013.01); H05K 3/4623 (2013.01); H05K 3/4697 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09145 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10416 (2013.01); H05K 2203/063 (2013.01);
Abstract

A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.


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