The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Dec. 28, 2015
Masato Kasashima, Gifu, JP;
Tomoyoshi Kobayashi, Aichi, JP;
Satoru Sasaki, Aichi, JP;
Yoshihiro Ikushima, Aichi, JP;
Masato Kasashima, Gifu, JP;
Tomoyoshi Kobayashi, Aichi, JP;
Satoru Sasaki, Aichi, JP;
Yoshihiro Ikushima, Aichi, JP;
OMRON AUTOMOTIVE ELECTRONICS CO., LTD., Aichi, JP;
Abstract
A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided, a metal core provided on the lower surface of the first insulating layer, in such a way as to vertically overlap with the mounting regions, and a second insulating layer provided on the lower surface of the first insulating layer, around the metal core. The lower surface of the metal core is exposed from the second insulating layer, the thermal conductivities of the first insulating layer and the metal core are higher than the thermal conductivity of the second insulating layer, and the hardness of the first insulating layer is higher than the hardness of the second insulating layer. Through holes that penetrate the insulating layers and that connect wiring patterns of the insulating layers are provided.