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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9923542 B1

PDFFull Text
Date of Patent:
Mar. 20, 2018

Filed:

Nov. 25, 2015

Radio-frequency module component

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Kenichiro Kikuchi, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Robert J Pascal

Assistant Examiner:

Kimberly Glenn

Int. Cl.
CPC ...
H03H 7/46 (2006.01); H03F 3/19 (2006.01); H03H 7/01 (2006.01); H03H 11/04 (2006.01); H03K 17/56 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H03H 7/46 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H03F 3/19 (2013.01); H03H 7/0138 (2013.01); H03H 7/0161 (2013.01); H03H 7/463 (2013.01); H03H 11/04 (2013.01); H03K 17/56 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/14215 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/3025 (2013.01); H03F 2200/451 (2013.01); H03H 2001/0085 (2013.01);
Abstract

A radio-frequency module component includes a splitter/combiner and a shield case. The splitter/combiner includes a multilayer body, a common input/output electrode, a low-band input/output electrode, a high-band input/output electrode, and outer ground electrodes. The multilayer body includes insulating layers and electrode patterns stacked on each other, and side surfaces opposed to each other. The common input/output electrode is disposed on one of the side surfaces and a bottom surface of the multilayer body. The low-band input/output electrode and the high-band input/output electrode are disposed on another of the side surfaces and the bottom surface of the multilayer body. An additional side surface of the multilayer body opposes a side surface of the shield case in the closest proximity to each other.

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