The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Jul. 24, 2015
Applicant:

Konica Minolta, Inc., Tokyo, JP;

Inventors:

Kazuhiro Yoshida, Hino, JP;

Shigeru Kojima, Hino, JP;

Shun Furukawa, Sagamihara, JP;

Takeshi Hakii, Sagamihara, JP;

Toshiyuki Kinoshita, Hino, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/08 (2006.01); H01L 51/52 (2006.01); B32B 7/02 (2006.01); B32B 5/16 (2006.01); B32B 37/14 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5215 (2013.01); B32B 5/16 (2013.01); B32B 7/02 (2013.01); B32B 37/14 (2013.01); H01L 51/5234 (2013.01); H01L 51/56 (2013.01); B32B 2457/206 (2013.01); H01L 2251/305 (2013.01); H01L 2251/5369 (2013.01);
Abstract

Provided are: a transparent electrode which exhibits excellent resistance to high temperature and high humidity, while having surface smoothness; a method for producing this transparent electrode; and an electronic device which has improved reliability by using this transparent electrode. A transparent electrode is configured to comprise a metal thin wire pattern that is formed on one main surface of a transparent substrate using metal nanoparticles and a metal oxide layer that has a surface roughness of 5 nm or less and is formed on the main surface of the transparent substrate so as to cover the surface of the metal thin wire pattern.


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