The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Jun. 09, 2016
Applicant:

Samsung Display Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Seungho Yoon, Yongin-si, KR;

Eunjeong Cho, Yongin-si, KR;

Assignee:

Samsung Display Co., Ltd., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/52 (2006.01); B32B 37/12 (2006.01); B32B 37/24 (2006.01); B32B 38/04 (2006.01); B32B 38/10 (2006.01); B32B 43/00 (2006.01); C09J 5/00 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01); B32B 37/00 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0097 (2013.01); B32B 37/025 (2013.01); B32B 38/10 (2013.01); H01L 51/003 (2013.01); H01L 51/56 (2013.01); B32B 2310/0843 (2013.01); B32B 2457/20 (2013.01); H01L 27/3244 (2013.01); H01L 2227/323 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01);
Abstract

A method of manufacturing a flexible display is disclosed. In one aspect, the method includes preparing a carrier comprising a first region and a second region surrounding the first region, forming a first substrate forming layer over at least the first region of the carrier, removing a top surface of the carrier from the second region of the carrier and forming an adhesive layer over the first substrate forming layer throughout the first and second regions of the carrier. The method also includes forming a second substrate forming layer over the adhesive layer throughout the first and second regions of the carrier, and separating the first substrate forming layer from the carrier.


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