The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Mar. 27, 2015
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Jeong Han Kim, Seoul, KR;
Jeung Ook Park, Seoul, KR;
Sang In Yoon, Seoul, KR;
Hyun Gu Im, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/44 (2010.01); H01L 33/00 (2010.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 33/38 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 33/00 (2013.01); H01L 33/38 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H05K 1/02 (2013.01); H05K 1/18 (2013.01); H05K 1/183 (2013.01);
Abstract
A printed circuit board having an improved heat radiation performance, and a light-emitting device including the same are provided. The printed circuit board includes a first electrode layer, a first insulation layer disposed on one surface of the first electrode layer, and a second electrode layer disposed on the first insulation layer. The first insulation layer includes a cavity formed through a part thereof. At least a portion of the one surface of the first electrode layer may be exposed to the outside through the cavity.