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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9923105 B1

PDFFull Text
Date of Patent:
Mar. 20, 2018

Filed:

Oct. 08, 2014

Processing of a direct-bandgap chip after bonding to a silicon photonic device

Applicant:

Skorpios Technologies, Inc., Albuquerque, NM (US);

Inventors:

Stephen B. Krasulick, Albuquerque, NM (US);

John Dallesasse, Geneva, IL (US);

Amit Mizrahi, Albuquerque, NM (US);

Timothy Creazzo, Albuquerque, NM (US);

Elton Marchena, Albuquerque, NM (US);

John Y. Spann, Albuquerque, NM (US);

Assignee:

Skorpios Technologies, Inc., Albuquerque, NM (US);

Attorney:

Kilpatrick Townsend & Stockton LLP

Primary Examiner:

Bilkis Jahan

Assistant Examiner:

Victor Barzykin

Int. Cl.
CPC ...
H01L 31/0232 (2014.01); H01S 5/022 (2006.01); H01S 5/026 (2006.01); H01S 5/30 (2006.01); H01S 5/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02327 (2013.01); H01S 5/026 (2013.01); H01S 5/02248 (2013.01); H01S 5/02268 (2013.01); H01S 5/02272 (2013.01); H01S 5/3013 (2013.01); H01S 5/021 (2013.01); H01S 5/02252 (2013.01);
Abstract

A method for fabricating a photonic composite device for splitting functionality across materials comprises providing a composite device having a platform and a chip bonded in the platform. The chip is processed comprising patterning, etching, deposition, and/or other processing steps while the chip is bonded to the platform. The chip is used as a gain medium and the platform is at least partially made of silicon.

Find Patent Forward Citations

Krasulick, Stephen. (2018). Processing of a direct-bandgap chip after bonding to a silicon photonic device (U.S. Patent No. 9923105). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9923105

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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