The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Apr. 10, 2017
Applicant:

Sandisk Technologies Llc, Plano, TX (US);

Inventors:

Xuehong Yu, San Jose, CA (US);

Yingda Dong, San Jose, CA (US);

Assignee:

SanDisk Technologies LLC, Plano, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/115 (2017.01); H01L 27/11582 (2017.01); H01L 23/528 (2006.01); H01L 27/11556 (2017.01); H01L 29/04 (2006.01); H01L 29/167 (2006.01); H01L 21/311 (2006.01); H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 21/225 (2006.01); H01L 21/223 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/02532 (2013.01); H01L 21/02636 (2013.01); H01L 21/2236 (2013.01); H01L 21/2256 (2013.01); H01L 21/31111 (2013.01); H01L 23/528 (2013.01); H01L 27/11556 (2013.01); H01L 29/04 (2013.01); H01L 29/0649 (2013.01); H01L 29/167 (2013.01); H01L 21/02592 (2013.01); H01L 21/02595 (2013.01);
Abstract

A three-dimensional stacked memory device provides uniform programming speeds for a block of memory cells. The channel layers of the memory strings which are relatively close to a local interconnect of a stack are doped to account for a reduced blocking oxide thickness. Channel layers of remaining memory strings are undoped. The doping can be performing by masking the channel layers which are to remain undoped while exposing the other memory holes to a dopant. The dopant can be provided, e.g., in a carrier gas, spin on glass or other solid, or by plasma doping. An n-type dopant such as antimony, arsenic or phosphorus may be used. Heating causes the dopants to diffuse into the channel layer. Another approach deposits doped silicon for some of the channel layers and undoped silicon for other channel layers.


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