The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Sep. 26, 2014
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Je-Hsiung Jeffrey Lan, San Diego, CA (US);
Wenyue Zhang, San Diego, CA (US);
Yang Du, Carlsbad, CA (US);
Yong Ju Lee, San Diego, CA (US);
Shiqun Gu, San Diego, CA (US);
Jing Xie, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 21/683 (2006.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 25/00 (2006.01); H01L 27/06 (2006.01); H01L 21/822 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/02164 (2013.01); H01L 21/265 (2013.01); H01L 21/6835 (2013.01); H01L 21/76254 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 21/8221 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 25/50 (2013.01); H01L 27/0688 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A microelectromechanical system (MEMS) bond release structure is provided for manufacturing of three-dimensional integrated circuit (3D IC) devices with two or more tiers. The MEMS bond release structure includes a MEMS sacrificial release layer which may have a pillar or post structure, or alternatively, a continuous sacrificial layer for bonding and release.