The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Jul. 27, 2015
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventor:

Yoshiki Kawazu, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 23/13 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49861 (2013.01); H01L 21/481 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/4867 (2013.01); H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 2223/6611 (2013.01);
Abstract

An electronic component housing package includes an insulating base including an upper surface, the insulating base including a first cut-out portion and a second cut-out portion which are provided on a lower surface of the insulating base. The first cut-out portion is formed by cutting into a lower part of a side surface of the insulating base and cutting out from the lower part to a lower surface of the insulating base. On the first cut-out portion are formed wiring conductors which are led from the lower surface of the insulating base and come to the upper surface of the insulating base through the insulating base via an inside wall surface of the first cut-out portion. The second cut-out portion is provided between the wiring conductors and extends from the inside wall surface of the first cut-out portion to the lower surface of the insulating base.


Find Patent Forward Citations

Kawazu, Yoshiki. (2018). Electronic component housing package, and electronic device comprising same (U.S. Patent No. 9922925). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9922925

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…