The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Feb. 22, 2017
Applicant:

Sandisk Technologies Llc, Plano, TX (US);

Inventors:

Chia-Lin Hsiung, Mountain View, CA (US);

Yanbin An, Santa Clara, CA (US);

Alexander Chu, San Francisco, CA (US);

Fumiaki Toyama, Cupertino, CA (US);

Assignee:

SANDISK TECHNOLOGIES LLC, Plano, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/00 (2006.01); G11C 16/26 (2006.01); G11C 16/04 (2006.01); G11C 16/08 (2006.01); G11C 16/10 (2006.01); G11C 16/34 (2006.01);
U.S. Cl.
CPC ...
G11C 16/26 (2013.01); G11C 16/0466 (2013.01); G11C 16/0483 (2013.01); G11C 16/08 (2013.01); G11C 16/10 (2013.01); G11C 16/3459 (2013.01);
Abstract

Systems and methods for reducing the area and improving the performance of a non-volatile memory array are described. The non-volatile memory array may comprise a 3D NAND memory array that includes vertical NAND strings that are arranged orthogonal to a substrate. A vertical NAND string may include floating gate memory cell transistors or charge trap memory cell transistors. Sensing circuitry for sensing the programmed data states of memory cell transistors within the vertical NAND strings may be positioned underneath the 3D NAND memory array and connections from bit lines positioned above the 3D NAND memory array may be made using vertical connections extending though the 3D NAND memory array or through memory breaks within the 3D NAND memory array.


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