The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Nov. 10, 2016
Applicants:
Fu Tai Hua Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Inventors:
Assignees:
Fu Tai Hua Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 5/02 (2006.01); H05K 7/20 (2006.01); G03F 7/20 (2006.01); G03F 7/42 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); G03F 7/20 (2013.01); G03F 7/42 (2013.01); H05K 5/0213 (2013.01); H05K 7/20409 (2013.01);
Abstract
A method for manufacturing a housing of an electronic device includes the following steps. An area not to be etched is shielded and an etching area is exposed. The etching area is etched by photolithography and forming a plurality of heat dissipation holes of nanometer scale in the etching area. The area not to be etched is cleaned for removing the shielding.