The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Feb. 13, 2013
Applicant:

California Institute of Technology, Pasadena, CA (US);

Inventors:

Steven Bowers, Duarte, CA (US);

Amirreza Safaripour Tabbalvandani, Pasadena, CA (US);

Seyed Ali Hajimiri, La Canada, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 29/10 (2006.01); G01R 29/08 (2006.01); H01Q 1/38 (2006.01); H01Q 13/10 (2006.01); H01Q 21/06 (2006.01); H01Q 21/24 (2006.01); H01Q 21/28 (2006.01); G01R 31/308 (2006.01);
U.S. Cl.
CPC ...
G01R 29/0878 (2013.01); H01Q 1/38 (2013.01); H01Q 13/10 (2013.01); H01Q 21/061 (2013.01); H01Q 21/24 (2013.01); H01Q 21/28 (2013.01); G01R 31/308 (2013.01);
Abstract

A sensing structure includes an integrated circuit substrate, and a first sensor formed on or above the integrated circuit substrate adapted to detect a first part of an electromagnetic field in the integrated circuit substrate. A sensing structure includes a dielectric substrate and a first sensor formed on or above the dielectric substrate adapted to detect a first part of an electromagnetic field in the integrated circuit substrate. A sensing structure includes an integrated circuit substrate and a multitude of sensors formed on or above the integrated circuit substrate adapted to detect a multitude of parts of an electromagnetic field in the integrated circuit substrate. A method for sensing a first part of an electromagnetic field includes providing an integrated circuit substrate, forming a first sensor on or above the integrated circuit substrate, and detecting the first part of the electromagnetic field in the integrated circuit substrate.


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