The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Mar. 16, 2016
Applicant:
Ti Automotive (Fuldabrück) Gmbh, Fuldabrück, DE;
Inventors:
Werner Zimmer, Melsungen Röhrenfurth, DE;
Frank Fahrenholz, Kassel, DE;
Assignee:
TI Automotive (Fuldabrück) GmbH, Fuldabrück, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F02M 37/00 (2006.01); B32B 7/04 (2006.01); B32B 7/08 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/34 (2006.01); B32B 1/08 (2006.01); B32B 3/02 (2006.01); B32B 3/26 (2006.01); B32B 3/28 (2006.01); B32B 3/30 (2006.01); F16L 9/12 (2006.01); F16L 9/133 (2006.01); B29C 47/06 (2006.01); B29C 47/00 (2006.01); B29C 47/26 (2006.01); F16L 11/04 (2006.01);
U.S. Cl.
CPC ...
F02M 37/0017 (2013.01); B29C 47/065 (2013.01); B32B 1/08 (2013.01); B32B 3/02 (2013.01); B32B 3/26 (2013.01); B32B 3/263 (2013.01); B32B 3/28 (2013.01); B32B 3/30 (2013.01); B32B 7/04 (2013.01); B32B 7/08 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/306 (2013.01); B32B 27/34 (2013.01); F16L 9/121 (2013.01); F16L 9/123 (2013.01); F16L 9/133 (2013.01); B29C 47/0023 (2013.01); B29C 47/26 (2013.01); B32B 2307/724 (2013.01); B32B 2307/7242 (2013.01); B32B 2307/7244 (2013.01); B32B 2307/7265 (2013.01); B32B 2597/00 (2013.01); B32B 2605/08 (2013.01); F16L 2011/047 (2013.01);
Abstract
A multilayered motor vehicle pipeline, wherein the pipeline has at least two layers, preferably at least three layers of plastic. At least one surface of at least one layer connected to another layer is configured profiled, wherein the profiling has maxima and minima. The height difference Δh between the maxima and the minima directly adjacent to the maxima is between 1 and 100 μm.