The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Jan. 12, 2015
Applicant:
Incodema3d, Llc, Ithaca, NY (US);
Inventors:
Kevin Engel, Ithaca, NY (US);
Scott Volk, Ithaca, NY (US);
Jerry Rushak, Cortland, NY (US);
Peter Engel, Walworth, NY (US);
Assignee:
Incodema3D, LLC, Ithaca, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F 1/30 (2006.01); B22F 3/10 (2006.01); B22F 3/24 (2006.01); B23K 31/02 (2006.01); B23K 37/00 (2006.01); C22C 14/00 (2006.01); C22C 19/03 (2006.01); C22C 38/00 (2006.01); C22C 38/18 (2006.01); C23F 1/08 (2006.01); C23F 1/28 (2006.01); B22F 3/105 (2006.01); C23F 1/04 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
C23F 1/30 (2013.01); B22F 3/10 (2013.01); B22F 3/1055 (2013.01); B22F 3/24 (2013.01); B23K 31/02 (2013.01); B23K 37/00 (2013.01); C22C 14/00 (2013.01); C22C 19/03 (2013.01); C22C 38/00 (2013.01); C22C 38/18 (2013.01); C23F 1/04 (2013.01); C23F 1/08 (2013.01); C23F 1/28 (2013.01); B22F 2003/1056 (2013.01); B22F 2003/1058 (2013.01); B22F 2003/241 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 80/00 (2014.12); Y02P 10/295 (2015.11);
Abstract
A build piece is made from a build plan by an additive metal deposition process, the build plan created from a three dimensional definition of a desired part, the build plan having a first set of dimensions corresponding to the desired part and includes a support structure. The build piece is to a chemical etchant such that the support structure is removed from the build piece and the dimensions of the build piece corresponding to the desired part are reduced to a second set of dimensions.