The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Jul. 21, 2015
Kenichi Itoh, Yokohama, JP;
Masami Mesuda, Sagamihara, JP;
Hitoshi Nagayama, Kawasaki, JP;
Tetsuo Shibutami, Sagamihara, JP;
Shunsuke Yatsunami, Yamagata, JP;
Kenichi Itoh, Yokohama, JP;
Masami Mesuda, Sagamihara, JP;
Hitoshi Nagayama, Kawasaki, JP;
Tetsuo Shibutami, Sagamihara, JP;
Shunsuke Yatsunami, Yamagata, JP;
TOSOH CORPORATION, Yamaguchi, JP;
Abstract
Provided is an apparatus that includes a molding die for producing a sintered body. The molding die is configured for cold isostatic pressing and includes a knockdown mold frame comprised of plural frame members and a bottom plate provided in contact with the knockdown mold frame. An upper punch is provided to be movable along the inner surface of the knockdown mold frame. The frame members configured to be movable relative to each other to accommodate an expansion of a green body which takes place at the time of reducing the pressure after the completion of pressing.