The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

May. 06, 2016
Applicant:

Nan Ya Plastics Corporation, Taipei, TW;

Inventors:

Te-Chao Liao, Taipei, TW;

Jung-Jen Chuang, Taipei, TW;

Hao-Sheng Chen, Taipei, TW;

Yi-Cheng Li, Taipei, TW;

Zhang-Jian Huang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 171/12 (2006.01); C08G 65/46 (2006.01); C08L 71/12 (2006.01); C08G 65/48 (2006.01);
U.S. Cl.
CPC ...
C09D 171/12 (2013.01); C08G 65/46 (2013.01); C08G 65/485 (2013.01); C08L 71/12 (2013.01);
Abstract

A process for preparing PPE microspore dispersion includes steps of: dissolving a high-molecular polyphenylene ether in a first solvent at 45-110° C. to form a dissolution liquid; adding processing aids and well mixing the dissolution liquid into a dispersed phase; cooling the dissolution liquid to 42-80° C., and adding a second solvent to generate PPE microspores via PPE to wrap around the processing aids; cooling the dissolution liquid to 0-40° C. to obtain PPE microspore dispersions for use in application for impregnation processes performed below 40° C., thereby high-temperature impregnation equipment are no longer needed, and copper clad laminates made of using the PPE microspore dispersion enjoy excellent physical properties including high Tg, low Dk, low Df and high copper foil's peel strength.


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