The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Feb. 24, 2014
Applicant:

Mitsubishi Rayon Co., Ltd., Chiyoda-ku, JP;

Inventors:

Tomonari Yoshimura, Yokohama, JP;

Kenji Yagi, Otake, JP;

Junichi Ikeno, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); F21V 8/00 (2006.01); B29D 11/00 (2006.01); B29K 33/00 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); B29D 11/00721 (2013.01); G02B 6/0041 (2013.01); G02B 6/0051 (2013.01); G02B 6/0065 (2013.01); G02B 6/0073 (2013.01); B29K 2033/08 (2013.01); C08J 2205/044 (2013.01); C08J 2333/12 (2013.01);
Abstract

Provided are a thermoplastic resin shaped-article in which vacancies with satisfactory light emission efficiency are formed, and a thermoplastic resin light guide that uses the thermoplastic resin shaped-article. Pulse laser irradiation is performed in a state in which the pulse laser is focused to an inner region of a primary thermoplastic resin shaped-article, thereby forming cracks at the inner side of the primary thermoplastic resin shaped-article. Then, a heat treatment is performed at a temperature equal to or higher than a glass transition temperature of a thermoplastic resin that constitutes the primary thermoplastic resin shaped-article, thereby obtaining a thermoplastic resin shaped-articlein which substantially spherical vacancieshaving minimum diameter of 30 μm or more are formed only at the inner region distant from a surface thereof by 10 μm or more.


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