IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9919454 B1

PDFFull Text
Date of Patent:
Mar. 20, 2018

Filed:

Jul. 06, 2015

Article of footwear formed from two preforms and method and mold for manufacturing same

Applicant:

Nike, Inc., Beaverton, OR (US);

Inventors:

Thienchai Chaisumrej, Bangkok, TH;

Tee L. Wan, Portland, OR (US);

Gjermund Haugbro, Beaverton, OR (US);

Chia-Yi Wu, Long An Province, VN;

Assignee:

NIKE, Inc., Beaverton, OR (US);

Attorney:

Banner & Witcoff, Ltd.

Primary Examiner:

Atul P Khare

Int. Cl.
CPC ...
B29C 33/00 (2006.01); A43B 13/12 (2006.01); B29D 35/12 (2010.01); B29C 44/12 (2006.01); B29D 35/10 (2010.01); B29D 35/14 (2010.01); A43B 13/38 (2006.01); A43B 13/40 (2006.01); B29C 65/18 (2006.01); B29C 65/70 (2006.01); B29K 31/00 (2006.01); B29K 105/00 (2006.01); B29L 9/00 (2006.01); B29L 31/50 (2006.01);
U.S. Cl.
CPC ...
B29C 33/0055 (2013.01); A43B 13/127 (2013.01); A43B 13/386 (2013.01); A43B 13/40 (2013.01); B29C 44/1204 (2013.01); B29C 65/18 (2013.01); B29C 65/70 (2013.01); B29D 35/10 (2013.01); B29D 35/122 (2013.01); B29D 35/142 (2013.01); B29D 35/148 (2013.01); B29D 2009/00 (2013.01); B29K 2031/04 (2013.01); B29K 2105/253 (2013.01); B29L 2009/00 (2013.01); B29L 2031/504 (2013.01);
Abstract

A method of manufacturing a midsole includes placing first and second preforms into a midsole recess of a mold, with first and second portions of the mold defining a first overflow chamber connected to the first recess; closing the mold by positioning the first and second portions in contact with one another; heating the mold for a predetermined period of time at a predetermined temperature such that the first and second preforms melt and bond together to form a midsole, with a portion of each of the first and second preforms flowing into the first overflow chamber to form a first overflow portion; removing the midsole from the mold; allowing the midsole to expand; and cutting away the first overflow portion.

Find Patent Forward Citations

Loading…