The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Jan. 09, 2014
Applicant:

Origin Electric Company, Limited, Toshima-ku, Tokyo, JP;

Inventors:

Jun Matsuda, Tokyo, JP;

Takayuki Suzuki, Tokyo, JP;

Masami Kuroda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/005 (2006.01); B23K 1/008 (2006.01); H05K 3/34 (2006.01); B23K 3/08 (2006.01); B23K 35/26 (2006.01); B23K 3/04 (2006.01); B23K 1/00 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 1/005 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 3/04 (2013.01); B23K 3/085 (2013.01); B23K 35/26 (2013.01); B23K 2201/42 (2013.01); H05K 3/3494 (2013.01); H05K 2203/085 (2013.01);
Abstract

A heat-bonding apparatus and method of manufacturing a heat-bonded product not allowing the temperature of the object to be heat-bonded to overshoot greatly from a specified target temperature, and setting the temperature of the object to the target temperature in a shorter time and with higher efficiency and accuracy than the conventional when heat-bonding in vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for the buffer part in contact with the object in the chamber, a cooler for the buffer part, a sensor for detecting temperature of the object heated through the buffer part and a controller for controlling the temperature of the object to be the target temperature by adjusting heat discharge from the buffer part with the cooler based on the detected temperature of the object.


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