The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

Apr. 04, 2016
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventor:

Toshihisa Yamamoto, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, Aichi-pref., JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/00 (2006.01); B62D 5/04 (2006.01); H02K 11/25 (2016.01); H02K 11/33 (2016.01);
U.S. Cl.
CPC ...
H05K 3/0061 (2013.01); B62D 5/0406 (2013.01); B62D 5/0496 (2013.01); H02K 11/25 (2016.01); H02K 11/33 (2016.01); H05K 1/0204 (2013.01); H05K 1/0201 (2013.01); H05K 1/0207 (2013.01); H05K 2201/062 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10409 (2013.01);
Abstract

An electronic unit includes a heat sink, a substrate, a heating component, a temperature sensor, a first interconnection, and a second interconnection. The heat sink includes a strut. The substrate is fixed to the strut of the heat sink. The heating component is mounted on the substrate to generate heat upon energization of the heating component. The temperature sensor is mounted on the substrate to detect temperature. The first interconnection is provided in a high-temperature region in which the heating component is mounted on the substrate, and is connected to the strut of the heat sink. The second interconnection is provided in a detection region in which the temperature sensor is mounted on the substrate, and is provided separately from the first interconnection. The second interconnection is connected to the strut of the heat sink and the temperature sensor.


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