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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9918382 B1

PDFFull Text
Expired
Date of Patent:
Mar. 13, 2018

Filed:

Jul. 11, 2017

Patterned metallization handle layer for controlled spalling

Applicants:

International Business Machines Corporation, Armonk, NY (US);

King Abdulaziz City for Science and Technology, Riyadh, SA;

Inventors:

Turki bin Saud bin Mohammed Al-Saud, Riyadh, SA;

Stephen W. Bedell, Wappingers Falls, NY (US);

Keith E. Fogel, Hopewell Junction, NY (US);

Paul A. Lauro, Brewster, NY (US);

Devendra K. Sadana, Pleasantville, NY (US);

Assignees:

International Business Machines Corporation, Armonk, NY (US);

KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGY, Riyadh, SA;

Attorneys:

Scully, Scott, Murphy & Presser, P.C.

Louis J. Percello, Esq.

Primary Examiner:

Tremesha S Willis

Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H01L 31/18 (2006.01); H01L 21/304 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H01L 21/304 (2013.01); H01L 31/1892 (2013.01); H05K 1/0271 (2013.01); H05K 1/09 (2013.01); H05K 1/092 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01);
Abstract

A handle substrate having at least one metallization region is provided on a stressor layer that is located above a base substrate such that the at least one metallization region is in contact with a surface of the stressor layer. An upper portion of the base substrate is spalled, i.e., removed, to provide a structure comprising, from bottom to top, a spalled material portion of the base substrate, the stressor layer and the handle substrate containing the at least one metallization region in contact with the surface of the stressor layer.

Find Patent Forward Citations

Al-Saud, Turki bin Saud bin Mohammed. (2018). Patterned metallization handle layer for controlled spalling (U.S. Patent No. 9918382). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9918382

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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