The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2018
Filed:
Jan. 31, 2012
Sagi Varghese Mathai, Berkeley, CA (US);
Michael Renne Ty Tan, Menlo Park, CA (US);
Paul Kessler Rosenberg, Sunnyvale, CA (US);
Wayne Victor Sorin, Mountain View, CA (US);
Georgios Panotopoulos, Berkeley, CA (US);
Susant K. Patra, Brentwood, CA (US);
Joseph Straznicky, Santa Rosa, CA (US);
Sagi Varghese Mathai, Berkeley, CA (US);
Michael Renne Ty Tan, Menlo Park, CA (US);
Paul Kessler Rosenberg, Sunnyvale, CA (US);
Wayne Victor Sorin, Mountain View, CA (US);
Georgios Panotopoulos, Berkeley, CA (US);
Susant K. Patra, Brentwood, CA (US);
Joseph Straznicky, Santa Rosa, CA (US);
Hewlett Packard Enterprise Development LP, Houston, TX (US);
Abstract
A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided.