The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

May. 30, 2017
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Takeshi Kogure, Nagaokakyo, JP;

Atsushi Ono, Nagaokakyo, JP;

Hiroyuki Nagamori, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/525 (2015.01); H04B 1/44 (2006.01); H04B 1/04 (2006.01); H04B 1/12 (2006.01); G01S 1/20 (2006.01); H03J 7/18 (2006.01);
U.S. Cl.
CPC ...
H04B 1/525 (2013.01); G01S 1/20 (2013.01); H03J 7/186 (2013.01); H04B 1/04 (2013.01); H04B 1/123 (2013.01); H04B 1/44 (2013.01); H04B 2001/045 (2013.01);
Abstract

A radio-frequency module includes a first transmitter-and-receiver that transmits and receives a signal in a first band, and a second transmitter-and-receiver that transmits and receives a signal in a second band higher than the first band. The first transmitter-and-receiver includes a first amplifier circuit and a first separator circuit and the second transmitter-and-receiver includes a second amplifier circuit and a second separator circuit. The first separator is located on a substrate between the first amplifier circuit and the second separator circuit, such that the first separator circuit is spatially interposed between the first amplifier circuit and the second separator circuit.


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