The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2018
Filed:
May. 30, 2013
Koninklijke Philips N.v., Eindhoven, NL;
Peter Dirksen, Eindhoven, NL;
KONINKLUJKE PHILIPS N.V., Eindhoven, NL;
Abstract
The present invention relates to a wafer () being subdivided and separable into a plurality of dies. Each die () comprises an array of capacitive micro-machined transducer cells (). Each cell comprises a substrate () comprising a first electrode (), a membrane () comprising a second electrode (), and a cavity () between the substrate () and the membrane (). Each cell () of at least a part of the dies () comprises a compensating plate () on the membrane (), each compensating plate () having a configuration for influencing a bow (h) of the membrane (). The configurations of the compensating plates () vary across the wafer (). The present invention further relates to a method of manufacturing such a wafer and a method of manufacturing such a die.