The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

Oct. 16, 2014
Applicant:

Analog Devices, Inc., Norwood, MA (US);

Inventors:

Thomas Kieran Nunan, Carlisle, MA (US);

Eugene Oh Hwang, Medford, MA (US);

Sunil Ashok Bhave, Cambridge, MA (US);

Assignee:

Analog Devices, Inc., Norwood, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/32 (2006.01); H01L 41/047 (2006.01); G01C 19/5769 (2012.01); H01L 41/29 (2013.01); H01L 41/332 (2013.01); H01L 41/113 (2006.01); H01L 41/08 (2006.01);
U.S. Cl.
CPC ...
H01L 41/047 (2013.01); G01C 19/5769 (2013.01); H01L 41/0475 (2013.01); H01L 41/0477 (2013.01); H01L 41/0478 (2013.01); H01L 41/113 (2013.01); H01L 41/29 (2013.01); H01L 41/332 (2013.01); H01L 41/0805 (2013.01);
Abstract

A single photo mask can be used to define the three critical layers for the piezoelectric MEMS device, specifically the top electrode layer, the piezoelectric material layer, and the bottom electrode layer. Using a single photo mask removes the misalignment source caused by using multiple photo masks. Furthermore, in certain exemplary embodiments, all electrical interconnects use underpass interconnect. This simplifies the process for defining the device electrodes and the process sequence for achieving self-alignment between the piezoelectric element and the top and bottom electrodes. This self-alignment is achieved by using an oxide hard mask to etch the critical region of the top electrode, the piezoelectric material, and the bottom electrode with one mask and different etch chemistries depending on the layer being etched.


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