The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

May. 22, 2015
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Korbinian Perzlmaier, Regensburg, DE;

Bjoern Muermann, Regensburg, DE;

Karl Engl, Pentling, DE;

Christian Eichinger, Wenzenbach, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/38 (2010.01); H01L 33/42 (2010.01); H01L 51/52 (2006.01); H01L 51/44 (2006.01); H01L 31/0224 (2006.01);
U.S. Cl.
CPC ...
H01L 33/38 (2013.01); H01L 31/022466 (2013.01); H01L 33/42 (2013.01); H01L 51/445 (2013.01); H01L 51/5215 (2013.01); H01L 51/5234 (2013.01);
Abstract

An electrical contact structure () for a semiconductor component () is specified, comprising a transparent electrically conductive contact layer (), on which a first metallic contact layer () is applied, a second metallic contact layer (), which completely covers the first metallic contact layer (), and a separating layer (), which is arranged between the transparent electrically conductive contact layer () and the second metallic contact layer () and which separates the second metallic contact layer () from the transparent electrically conductive contact layer (). Furthermore, a semiconductor component () comprising a contact structure () is specified.


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